Patent Assignment
Reel/Frame 033525/0626
Assignment of Assignor's Interest
Recorded: 2014-08-13
Pages: 2
Assignors
SAWAI, YUICHI
Executed: 2014-05-23
NAITO, TAKASHI
Executed: 2014-05-28
AOYAGI, TAKUYA
Executed: 2014-06-03
FUJIEDA, TADASHI
Executed: 2014-06-03
MORI, MUTSUHIRO
Executed: 2014-06-02
Assignee
HITACHI, LTD.
6-6, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Bonded Body and Semiconductor Module