Patent Assignment
Reel/Frame 033544/0827
Assignment of Assignor's Interest
Recorded: 2014-08-15
Pages: 10
Assignors
ANDRY, PAUL S.
Executed: 2014-08-04
DANG, BING
Executed: 2014-08-01
LEWANDOWSKI, ERIC P.
Executed: 2014-08-01
NAH, JAE-WOONG
Executed: 2014-08-01
WEBB, BUCKNELL C.
Executed: 2014-08-12
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Wafer Level Overmold for Three Dimensional Surfaces
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.