Wafer level overmold for three dimensional surfaces
View Patent ↗Embodiments of the invention include a method for shaping a flexible integrated circuit to a curvature and the resulting structure. A flexible circuit is provided. An epoxy resin and amine composition is deposited on the flexible integrated circuit. The deposited epoxy resin and amine composition is B-staged. The flexible integrated circuit is placed within a mold of a curvature. The B-staged epoxy resin and amine composition is cured subsequent to placing the flexible integrated circuit within the mold of the curvature.
1. A method for shaping a flexible integrated circuit to a curvature, the method comprising:
providing a flexible integrated circuit, wherein the flexible integrated circuit includes a flexible substrate that is substantially straight;
depositing an epoxy resin and amine composition on the flexible integrated circuit, wherein the epoxy resin and amine composition is liquid;
B-staging the deposited epoxy resin and amine composition;
placing the flexible integrated circuit on a mold, such that, at least, the flexible substrate is bent to a curvature; and
curing the B-staged epoxy resin and amine composition subsequent to placing the flexible integrated circuit on the mold.
2. The method of claim 1 , further comprising:
affixing the provided flexible integrated circuit to a rigid carrier prior to the step of depositing the epoxy resin and amine composition on the flexible integrated circuit; and
detaching the flexible integrated circuit from the rigid carrier subsequent to B-staging the deposited epoxy resin and amine composition.
3. The method of claim 1 , wherein curing the B-staged epoxy resin and amine composition comprises heating the B-staged epoxy resin and amine composition.
4. The method of claim 1 , where placing the flexible integrated circuit on the mold further comprises:
holding the flexible integrated circuit in place on the mold with a vacuum.
5. The method of claim 4 , wherein the mold is beneath the flexible integrated circuit.
6. The method of claim 1 , wherein placing the flexible integrated circuit on the mold comprises:
placing the flexible integrated circuit in an area between a first mold portion of the mold and a second mold portion of the mold, wherein the area formed between the first mold portion and the second mold portion corresponds to the curvature.
7. The method of claim 1 , wherein the provided flexible integrated circuit comprises a plurality of integrated circuits on the flexible substrate, further comprising:
singulating each of the plurality of integrated circuits.
8. The method of claim 1 , wherein the step of curing the B-staged epoxy resin and amine composition continues until the B-staged epoxy resin and amine composition is cured fully.
9. The method of claim 1 , wherein the flexible integrated circuit is a System-on-Package.
10. The method of claim 1 , wherein providing the flexible integrated circuit comprises:
providing a flexible substrate that is substantially straight; and
bonding a die to the flexible substrate.
11. A method for shaping a flexible integrated circuit to a curvature, the method comprising:
providing a flexible integrated circuit, wherein the flexible integrated circuit includes a flexible substrate that is substantially straight;
applying a B-staged epoxy resin and amine composition film on the flexible integrated circuit;
placing the flexible integrated circuit on a mold, such that, at least, the flexible substrate is bent to a curvature; and
curing the B-staged epoxy resin and amine composition film subsequent to placing the flexible integrated circuit on the mold.
12. The method of claim 11 , further comprising:
affixing the provided flexible integrated circuit to a rigid carrier prior to the step of applying the B-staged epoxy resin and amine composition film; and
detaching the flexible integrated circuit from the rigid carrier subsequent to B-staging the deposited epoxy resin and amine composition.
13. The method of claim 11 , wherein curing the B-staged epoxy resin and amine composition film comprises heating the B-staged epoxy resin and amine composition film.
14. The method of claim 11 , where placing the flexible integrated circuit on the mold further comprises:
holding the flexible integrated circuit in place on the mold with a vacuum.
15. The method of claim 11 , wherein placing the flexible integrated circuit on the mold comprises:
placing the flexible integrated circuit in an area between a first mold portion of the mold and a second mold portion of the mold, wherein the area formed between the first mold portion and the second mold portion corresponds to the curvature.
16. The method of claim 11 , wherein the provided flexible integrated circuit comprises a plurality of integrated circuits on a substrate, further comprising:
singulating each of the plurality of integrated circuits.
17. The method of claim 11 , wherein the step of curing the B-staged epoxy resin and amine composition film continues until the B-staged epoxy resin and amine composition film is cured fully.
18. The method of claim 11 , wherein the flexible integrated circuit is a System-on-Package.