IP Library Assignment 033549/0805
Patent Assignment
Reel/Frame 033549/0805

Change of Address

Recorded: 2014-08-15 Pages: 6
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2013-01-22
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property (1)
Polishing Agent for Copper Polishing and Polishing Method Using Same
Patent: 8,859,429 →
Application: 13/412,893 →
Publication: US 2012/0160804
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 17, 2012
From: ONO, HIROSHI; SHINODA, TAKASHI; OKADA, YUUHEI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 028060/0291 →
Change of Name Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →