Patent Assignment
Reel/Frame 033611/0177
Assignment of Assignor's Interest
Recorded: 2014-08-26
Pages: 4
Assignee
SILICONFILE TECHNOLOGIES INC.
20F BUNDANG SQUARE, 263 SEOHYEON-DONG, BUNDANG-GU, SEONGNAM-SI, GYEONGGI-DO, 463-050, KOREA, REPUBLIC OF
Covered Property
(1)
Stack Chip Package Image Sensor
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.