Patent Assignment
Reel/Frame 033622/0421
Assignment of Assignor's Interest
Recorded: 2014-08-27
Pages: 3
Assignee
STMICROELECTRONICS S.R.L.
VIA C. OLIVETTI, 2, AGRATE BRIANZA, 20864, ITALY
Covered Property
(1)
Microfluidic Die with a High Ratio of Heater Area to Nozzle Exit Area
Patent:
9,174,445 →
Application:
14/310,633 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 27, 2014
From: DODD, SIMON
To: STMICROELECTRONICS, INC.
Reel/Frame 033622/0540 →
Assignment of Assignor's Interest
Jan 31, 2022
From: STMICROELECTRONICS, INC.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 058835/0877 →
Assignment of Assignor's Interest
Mar 11, 2022
From: STMICROELECTRONICS S.R.L.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 059246/0754 →