IP Library › Granted Patent US 9,174,445
Granted Patent B1
US 9,174,445 · App. 14/310,633 · Granted Nov 3, 2015

Microfluidic die with a high ratio of heater area to nozzle exit area

Inventors: Daniele Prati (Catania, IT); Domenico Giusti (Monza, IT); Simon Dodd (West Linn, OR)
Assignees: STMicroelectronics S.r.l.; STMicroelectronics, Inc.
B41J2/14427B41J2/1408B41J2/14112B41J2/1648
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Quick Facts
Patent No.
US 9,174,445
App. No.
14/310,633
Granted
Nov 3, 2015
Kind
B1
Abstract

The present disclosure is directed to a microfluidic die having a substrate with an inlet path that is configured to move fluid into the die. The die includes a plurality of heaters formed above the substrate, each heater having a first area, a plurality of chambers formed above the plurality of heaters, and a plurality of nozzles formed above the chambers. Each nozzle having an entrance adjacent to the chamber and an exit adjacent to en external environment, the entrance having a second area, and the second having a third area, the first area being greater than the second area, and the second area being greater than the third area. A ratio of the first area to the third area being greater than 5 to 1.

Claims (28)

1. A device, comprising:

a substrate;

a plurality of heaters on the substrate, each heater having a heater area;

a plurality of nozzles disposed above the heaters, each nozzle having an entrance and an exit, each entrance being closer to a heater than the exit, the exit having a first nozzle area, a ratio of the heater area to the first nozzle area being greater than 9 to 1; and

a plurality of chambers disposed between the heaters and the nozzles.

2. The device of claim 1 wherein the nozzles are tapered such that the entrance has a second nozzle area, the second nozzle area being less than the heater area and the second nozzle area is greater than the first nozzle area.

3. The device of claim 2 wherein each chamber has a bottom surface having a chamber bottom area, the chamber bottom area being greater than the heater area.

4. The device of claim 2 wherein a ratio of the second nozzle area to the first nozzle area is greater than 1.2 to 1.

5. The device of claim 1 wherein the heater area exceeds 2000 μm 2 .

6. A device, comprising:

a substrate having an inlet path;

a plurality of heaters formed above the substrate, each heater having a heater area;

a plurality of chambers formed above the plurality of heaters; and

a plurality of tapered nozzles formed above the chambers, each tapered nozzle having an entrance adjacent to the chamber and an exit adjacent to an external environment, the entrance having a first nozzle area, and the exit having a second nozzle area, the heater area being greater than the first nozzle area, and the first nozzle area being greater than the second nozzle area, a ratio of the heater area to the second nozzle area being greater than 9 to 1.

7. The device of claim 6 further comprising a channel region between the inlet path and the plurality of chambers, the channel region including a plurality of funnel regions that feed fluid to the plurality of chambers.

8. The device of claim 7 further comprising a narrow fluid path between each funnel region and each chamber.

9. The device of claim 8 wherein each funnel region includes a first column to prevent in the fluid from blocking the fluid path.

10. The device of claim 9 further comprising a second column adjacent to the first column.

11. The device of claim 8 wherein each heater has a length and a width, a length of the fluid path being smaller than the length of the heater.

12. The device of claim 11 wherein a width of the fluid path is smaller than the width of the heater.

13. A method, comprising:

forming an inlet path in a substrate;

forming a plurality of heaters above the substrate, each heater having a heater area;

forming a plurality of chambers above the plurality of heaters; and

forming a plurality of tapered nozzles above the chambers, each a tapered nozzle having an entrance adjacent to the chamber and an exit adjacent to an external environment, the entrance having a first nozzle area, and the exit having a second nozzle area, the heater area being greater than the first nozzle area, and the first nozzle area being greater than the second nozzle area, a ratio of the heater area to the second nozzle area being greater than 9 to 1.

14. The method of claim 13 further comprising forming a channel region between the inlet path and the plurality of chambers, the channel region including a plurality of funnel regions that feed fluid to the plurality of chambers.

15. The method of claim 14 further comprising forming a narrow fluid path between each funnel region and each chamber.

16. The method of claim 15 further comprising forming a plurality of columns in the funnel region.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 11, 2022
From: STMICROELECTRONICS S.R.L.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 059246/0754 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 31, 2022
From: STMICROELECTRONICS, INC.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 058835/0877 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 27, 2014
From: PRATI, DANIELE; GIUSTI, DOMENICO
To: STMICROELECTRONICS S.R.L.
Reel/Frame 033622/0421 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 27, 2014
From: DODD, SIMON
To: STMICROELECTRONICS, INC.
Reel/Frame 033622/0540 →