Patent Assignment
Reel/Frame 033623/0466
Assignment of Assignor's Interest
Recorded: 2014-08-27
Pages: 5
Assignors
CHI, HEEJO
Executed: 2014-06-27
FOH, BARTHOLOMEW LIAO CHUNG
Executed: 2014-08-04
ALVAREZ, SHEILA MARIE L.
Executed: 2014-08-04
CAMACHO, ZIGMUND RAMIREZ
Executed: 2014-08-04
CUONG, DAO NGUYEN PHU
Executed: 2014-08-04
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Integrated Circuit Packaging System with Support Structure and Method of Manufacture Thereof
Patent:
9,502,267 →
Application:
14/316,190 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.