IP Library Assignment 033630/0791
Patent Assignment
Reel/Frame 033630/0791

Assignment of Assignor's Interest

Recorded: 2014-08-28 Pages: 3
Assignor
HARADA, YUSUKE
Executed: 1999-06-30
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12 TORANOMON 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property (1)
Semiconductor Device Having Damascene Interconnection Structure That Prevents Void Formation Between Interconnections Having Transparent Dielectric Substrate
Patent: 8,786,087 →
Application: 12/829,633 →
Publication: US 2010/0270675
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Aug 28, 2014
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 033630/0884 →
Change of Name Aug 29, 2014
From: OKI SEMICONDUCTOR CO., LTD.
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 033639/0817 →