Patent Assignment
Reel/Frame 033630/0884
Change of Name
Recorded: 2014-08-28
Pages: 5
Assignor
OKI ELECTRIC INDUSTRY CO., LTD.
Executed: 2008-10-01
Assignee
OKI SEMICONDUCTOR CO., LTD.
550-1 HIGASHIASAKAWA-CHO, HACHIOJI-SHI, TOKYO, 193-8550, JAPAN
Covered Property
(1)
Semiconductor Device Having Damascene Interconnection Structure That Prevents Void Formation Between Interconnections Having Transparent Dielectric Substrate
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.