IP Library › Assignment 033630/0964
Patent Assignment
Reel/Frame 033630/0964

Assignment of Assignor's Interest

Recorded: 2014-08-28 Pages: 3
Assignors
OHUCHI, SHINJI
Executed: 1999-11-26
YAMADA, SHIGERU
Executed: 1999-11-26
SHIRAISHI, YASUSHI
Executed: 1999-11-26
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12 TORANOMON 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property (1)
Method of Making Semiconductor Device Packaged by Sealing Resin Member
Patent: 8,008,129 →
Application: 12/759,919 →
Publication: US 2010/0197079
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Aug 28, 2014
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 033631/0007 →
Change of Name Aug 29, 2014
From: OKI SEMICONDUCTOR CO., LTD.
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 033639/0817 →