IP Library › Assignment 033631/0007
Patent Assignment
Reel/Frame 033631/0007

Change of Name

Recorded: 2014-08-28 Pages: 5
Assignor
OKI ELECTRIC INDUSTRY CO., LTD.
Executed: 2008-10-01
Assignee
OKI SEMICONDUCTOR CO., LTD.
550-1 HIGASHIASAKAWA-CHO, HACHIOJI-SHI, TOKYO, 193-8550, JAPAN
Covered Property (1)
Method of Making Semiconductor Device Packaged by Sealing Resin Member
Patent: 8,008,129 →
Application: 12/759,919 →
Publication: US 2010/0197079
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 28, 2014
From: OHUCHI, SHINJI; YAMADA, SHIGERU; SHIRAISHI, YASUSHI
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 033630/0964 →
Change of Name Aug 29, 2014
From: OKI SEMICONDUCTOR CO., LTD.
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 033639/0817 →