IP Library Assignment 033637/0559
Patent Assignment
Reel/Frame 033637/0559

Assignment of Assignor's Interest

Recorded: 2014-08-29 Pages: 2
Assignor
SUZUKI, SHINSUKE
Executed: 2004-12-20
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property (1)
Wire Bonding Method
Patent: 7,810,703 →
Application: 12/292,174 →
Publication: US 2009/0289099
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Aug 29, 2014
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 033637/0571 →
Change of Name Aug 29, 2014
From: OKI SEMICONDUCTOR CO., LTD.
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 033639/0817 →