IP Library › Assignment 033637/0571
Patent Assignment
Reel/Frame 033637/0571

Change of Name

Recorded: 2014-08-29 Pages: 5
Assignor
OKI ELECTRIC INDUSTRY CO., LTD.
Executed: 2008-10-01
Assignee
OKI SEMICONDUCTOR CO., LTD.
550-1 HIGASHIASAKAWA-CHO, HACHIOJI-SHI, TOKYO, 193-8550, JAPAN
Covered Property (1)
Wire Bonding Method
Patent: 7,810,703 →
Application: 12/292,174 →
Publication: US 2009/0289099
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 29, 2014
From: SUZUKI, SHINSUKE
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 033637/0559 →
Change of Name Aug 29, 2014
From: OKI SEMICONDUCTOR CO., LTD.
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 033639/0817 →