IP Library › Assignment 033639/0115
Patent Assignment
Reel/Frame 033639/0115

Assignment of Assignor's Interest

Recorded: 2014-08-29 Pages: 3
Assignors
NAKAMURA, TOSHIYUKI
Executed: 2005-10-03
MACHIDA, SATOSHI
Executed: 2005-10-03
YABE, SACHIKO
Executed: 2005-10-03
TAGUCHI, TAKASHI
Executed: 2005-10-03
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property (1)
Fabrication Method for Device Structure Having Transparent Dielectric Substrate
Patent: 8,076,220 →
Application: 12/779,244 →
Publication: US 2010/0240195
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Aug 29, 2014
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 033639/0134 →
Change of Name Aug 29, 2014
From: OKI SEMICONDUCTOR CO., LTD.
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 033639/0817 →