Patent Assignment
Reel/Frame 033639/0134
Change of Name
Recorded: 2014-08-29
Pages: 5
Assignor
OKI ELECTRIC INDUSTRY CO., LTD.
Executed: 2008-10-01
Assignee
OKI SEMICONDUCTOR CO., LTD.
550-1 HIGASHIASAKAWA-CHO, HACHIOJI-SHI, TOKYO, 193-8550, JAPAN
Covered Property
(1)
Fabrication Method for Device Structure Having Transparent Dielectric Substrate
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 29, 2014
From: NAKAMURA, TOSHIYUKI; MACHIDA, SATOSHI; YABE, SACHIKO; TAGUCHI, TAKASHI
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 033639/0115 →
Change of Name
Aug 29, 2014
From: OKI SEMICONDUCTOR CO., LTD.
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 033639/0817 →