Patent Assignment
Reel/Frame 033676/0839
Assignment of Assignor's Interest
Recorded: 2014-09-05
Pages: 4
Assignors
BAEK, KYUNG WOOK
Executed: 2014-09-02
LEE, KEON JAE
Executed: 2014-09-02
HWANG, GEON TAE
Executed: 2014-09-02
YOO, HYEON KYUN
Executed: 2014-09-02
KIM, DO HYUN
Executed: 2014-09-02
KIM, YOO SUN
Executed: 2014-09-02
Assignee
KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
291, DAEHAK-RO, YUSEONG-GU, DAEJEON, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Packaging Flexible Device Using Holding Wafer, and Flexible Device Manufactured by the Same