Method for packaging flexible device using holding wafer, and flexible device manufactured by the same
Provided is a flexible device, which includes a flexible substrate, a plurality of electrode lines provided on the flexible substrate and configured to contact the following anisotropic conductive film and then extend to a side of the flexible substrate, an anisotropic conductive film configured to contact the electrode line and laminated on the flexible substrate, a plurality of bumps provided on the anisotropic conductive film, and a circuit board having an electronic device provided at one side thereof and configured to contact the plurality of bumps.
1. A method for manufacturing a flexible device, comprising:
preparing an electronic device on an upper portion of a circuit board;
forming a bump on the electronic device such that the bump is attached to a top surface of the electronic device and protrudes upward from the electronic device;
bringing a fixed substrate into contact with an upper portion of the electronic device to fix the circuit board; then
reducing a thickness of the circuit board: then
bringing a support substrate formed of silicon or glass into contact with a lower portion of the circuit board; then
removing the fixed substrate; and then
laminating an anisotropic conductive film toward an upper portion of the electronic device and heating and pressing a flexible substrate having an electrode line thereto, such that the anisotropic conductive film covers and comes in direct contact with the top surface of the electronic device, a side surface of the bump and an entire top surface of the bump, and then
forming a passivation layer which comes in contact with the flexible substrate and coats a side surface of the anisotropic conductive film, a side surface of the circuit board and both of a side surface and a bottom surface of the support substrate formed of silicon or glass,
wherein the flexible substrate is disposed on the upper portion of the circuit board, while the support substrate formed of silicon or glass is maintained in contact with the lower portion of the circuit board,
wherein the electrode line of the flexible substrate is configured to contact the anisotropic conductive film and then extend to an outer side of the anisotropic conductive film.
2. The method for manufacturing a flexible device according to claim 1 ,
wherein the circuit board is a SOI substrate, and said reducing of a thickness of the circuit board is performed by etching a lower silicon layer of the SOI substrate.
3. The method for manufacturing a flexible device according to claim 1 ,
wherein said fixing of the circuit board is performed by adhering the fixed substrate to the electronic device on the circuit board.
4. The method for manufacturing a flexible device according to claim 1 ,
wherein said bringing of a support substrate into contact with a lower portion of the circuit board is performed by adhering the support substrate to the lower portion of the circuit board.
5. The method for manufacturing a flexible device according to claim 1 , wherein the bump includes a plurality of bumps which are spaced apart from each other by a predetermined distance.
6. The method for manufacturing a flexible device according to claim 1 , wherein the anisotropic conductive film is laminated to cover an entire upper surface of the electronic device.
7. The method for manufacturing a flexible device according to claim 1 , wherein:
the anisotropic conductive film has electrical conductivity in a vertical direction with electrical isolation property in a horizontal direction;
the flexible substrate, other than the electrode line, has electrical isolation property; and
the electronic device is electrically connected to the electrode line such that an electric signal generated from the electronic device is connected to the electrode line via the anisotropic conductive film having electrical conductivity in a vertical direction.