Patent Assignment
Reel/Frame 033680/0828
Assignment of Assignor's Interest
Recorded: 2014-09-05
Pages: 4
Assignors
PARK, MOON SOO
Executed: 2014-08-19
KIM, TAE YOUNG
Executed: 2014-08-19
LEE, DONG HWAN
Executed: 2014-08-19
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Chip Electronic Component and Method of Manufacturing the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 17, 2015
From: HONG, JONG-HO; PARK, JOON-YOUNG; PARK, WAN-KYO; AHN, JUN-SUNG
To: HYUNDAI MOTOR COMPANY; KIA MOTOR CORPORATION
Reel/Frame 036120/0395 →
Assignment of Assignor's Interest
Nov 10, 2016
From: PARK, MOON SOO; KIM, TAE YOUNG; LEE, DONG HWAN
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 040281/0459 →