Patent Assignment
Reel/Frame 036120/0395
Assignment of Assignor's Interest
Recorded: 2015-07-17
Pages: 5
Assignors
HONG, JONG-HO
Executed: 2015-07-02
PARK, JOON-YOUNG
Executed: 2015-07-06
PARK, WAN-KYO
Executed: 2015-07-06
AHN, JUN-SUNG
Executed: 2015-07-06
Assignees
HYUNDAI MOTOR COMPANY
12, HEOLLEUNG-RO, SEOCHO-GU, SEOUL, 137-938, KOREA, REPUBLIC OF
KIA MOTOR CORPORATION
12, HEOLLEUNG-RO, SEOCHO-GU, SEOUL, 137-938, KOREA, REPUBLIC OF
Covered Property
(1)
Chip Electronic Component and Method of Manufacturing the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 5, 2014
From: PARK, MOON SOO; KIM, TAE YOUNG; LEE, DONG HWAN
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 033680/0828 →
Assignment of Assignor's Interest
Nov 10, 2016
From: PARK, MOON SOO; KIM, TAE YOUNG; LEE, DONG HWAN
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 040281/0459 →