Patent Assignment
Reel/Frame 033706/0849
Assignment of Assignor's Interest
Recorded: 2014-09-10
Pages: 10
Assignors
WEBER, HERIBERT
Executed: 2014-07-02
KUEPPERS, HARTMUT
Executed: 2014-07-14
FREY, JENS
Executed: 2014-07-04
REINMUTH, JOCHEN
Executed: 2014-07-04
DAVIES, NEIL
Executed: 2014-07-08
Assignee
ROBERT BOSCH GMBH
POSTFACH 30 02 20, STUTTGART, DE-70442, GERMANY
Covered Property
(1)
Component in the Form of a Wafer Level Package and Method for Manufacturing Same