Patent Assignment
Reel/Frame 033715/0606
Assignment of Assignor's Interest
Recorded: 2014-09-10
Pages: 4
Assignor
JUNG, SEUNG WON
Executed: 2014-08-11
Assignee
UBMATERIALS INC.
10, HAKCHON-RO, YANGJI-MYEON, CHEOIN-GU, YONGIN-SI, GYEONGGI-DO, 449-823, KOREA, REPUBLIC OF
Covered Property
(1)
Abrasive Particle, Polishing Slurry, and Method of Manufacturing Semiconductor Device Using the Same
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
License
Feb 3, 2015
From: UB MATERIALS, INC.
To: SHIN-ETSU CHEMICAL CO., LTD.
Reel/Frame 034874/0855 →
Assignment of Assignor's Interest
Feb 5, 2015
From: UBMATERIALS INC.
To: INDUSTRIAL BANK OF KOREA
Reel/Frame 034902/0209 →
Assignment of Assignor's Interest
Mar 30, 2017
From: INDUSTRIAL BANK OF KOREA
To: SHIN-ETSU CHEMICAL CO., LTD.
Reel/Frame 042117/0501 →
Assignment of Assignor's Interest
Mar 3, 2022
From: SHIN-ETSU CHEMICAL CO., LTD.
To: UBMATERIALS INC.
Reel/Frame 059318/0078 →