Patent Assignment
Reel/Frame 042117/0501
Assignment of Assignor's Interest
Recorded: 2017-03-30
Pages: 2
Assignor
INDUSTRIAL BANK OF KOREA
Executed: 2017-03-03
Assignee
SHIN-ETSU CHEMICAL CO., LTD.
6-1, OHTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, 100-0004, JAPAN
Covered Property
(1)
Abrasive Particle, Polishing Slurry, and Method of Manufacturing Semiconductor Device Using the Same
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 10, 2014
From: JUNG, SEUNG WON
To: UBMATERIALS INC.
Reel/Frame 033715/0606 →
License
Feb 3, 2015
From: UB MATERIALS, INC.
To: SHIN-ETSU CHEMICAL CO., LTD.
Reel/Frame 034874/0855 →
Assignment of Assignor's Interest
Feb 5, 2015
From: UBMATERIALS INC.
To: INDUSTRIAL BANK OF KOREA
Reel/Frame 034902/0209 →
Assignment of Assignor's Interest
Mar 3, 2022
From: SHIN-ETSU CHEMICAL CO., LTD.
To: UBMATERIALS INC.
Reel/Frame 059318/0078 →