IP Library › Assignment 033734/0231
Patent Assignment
Reel/Frame 033734/0231

Assignment of Assignor's Interest

Recorded: 2014-09-12 Pages: 5
Assignors
CHA, HYE YEON
Executed: 2014-08-08
LEE, DONG HWAN
Executed: 2014-08-08
JUNG, JUNG HYUK
Executed: 2014-08-08
YOON, CHAN
Executed: 2014-08-08
BANK, HYE MIN
Executed: 2014-08-08
KIM, TAE YOUNG
Executed: 2014-08-08
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Chip Electronic Component and Manufacturing Method Thereof
Patent: 9,945,042 →
Application: 14/485,402 →
Publication: US 2015/0270053
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Spelling of the Last Name of the 5TH Assignor from "Bank" to "Bang" Previously Recorded on Reel 033734 Frame 0231. Assignor(S) Hereby Confirms the Assignment. Dec 18, 2014
From: CHA, HYE YEON; LEE, DONG HWAN; JUNG, JUNG HYUK; YOON, CHAN
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 034671/0735 →