Patent Assignment
Reel/Frame 033749/0318
Assignment of Assignor's Interest
Recorded: 2014-09-16
Pages: 4
Assignors
LAI, CHIEH-LUNG
Executed: 2014-03-27
CHEN, HSIEN-WEN
Executed: 2014-03-27
CHANG, HONG-DA
Executed: 2014-03-27
YEH, MAO-HUA
Executed: 2014-03-27
Assignee
SILICONWARE PRECISION INDUSTRIES CO., LTD.
NO. 123, SEC. 3, DA FONG ROAD, TANTZU, TAICHUNG, TAIWAN
Covered Property
(1)
Package Structure and Method for Fabricating the Same