Patent Assignment
Reel/Frame 033754/0539
Assignment of Assignor's Interest
Recorded: 2014-09-17
Pages: 5
Assignors
TEWS, DIRK
Executed: 2014-09-12
MICHALIK, FABIAN
Executed: 2014-09-16
IBÁNEZ, BELÉN GIL
Executed: 2014-09-12
BRANDT, LUTZ
Executed: 2014-08-26
HSIEH, MENG CHE
Executed: 2014-08-26
LIU, ZHIMING
Executed: 2014-08-27
Assignee
ATOTECH DEUTSCHLAND GMBH
ERASMUSSTRASSE 20, BERLIN, 10553, GERMANY
Covered Property
(1)
Method for Promoting Adhesion Between Dielectric Substrates and Metal Layers
Application:
14/385,779 →
Publication:
US 2015/0050422
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Feb 1, 2017
From: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA INC
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 041590/0001 →
Release of Security Interest
Mar 18, 2021
From: BARCLAYS BANK PLC, AS COLLATERAL AGENT
To: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA, LLC
Reel/Frame 055653/0714 →