Patent Assignment
Reel/Frame 033818/0623
Assignment of Assignor's Interest
Recorded: 2014-09-25
Pages: 6
Assignors
LEE, EUN-HA
Executed: 2014-09-15
BENAYAD, ANASS
Executed: 2014-09-15
KIM, TAE-SANG
Executed: 2014-09-15
SON, KYOUNG-SEOK
Executed: 2014-09-15
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Thin Film, Method of Forming Thin Film, Semiconductor Device Including Thin Film, and Method of Manufacturing Semiconductor Device