Patent Assignment
Reel/Frame 033902/0822
Assignment of Assignor's Interest
Recorded: 2014-10-07
Pages: 4
Assignor
ISHIZUKA, TOHRU
Executed: 2014-09-01
Assignee
SHIN-ETSU HANDOTAI CO., LTD.
6-2, OHTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Method for Manufacturing Bonded Wafer