Patent Assignment
Reel/Frame 034004/0185
Assignment of Assignor's Interest
Recorded: 2014-10-22
Pages: 17
Assignors
LEE, HYOSAN
Executed: 2014-09-30
KO, YONGSUN
Executed: 2014-09-30
KIM, KYOUNGSEOB
Executed: 2014-09-30
LEE, KUNTACK
Executed: 2014-09-30
JEONG, JIHOON
Executed: 2014-09-30
LIN, CHEN
Executed: 2014-06-30
OBER, CHRISTOPHER K.
Executed: 2014-08-23
Assignees
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 443-742, KOREA, REPUBLIC OF
CORNELL UNIVERSITY
CORNELL CENTER FOR TECHNOLOGY, ENTERPRISE & COMMERCIALIZATION ("CCTEC"), 395 PINE TREE ROAD, SUITE 310, ITHACA, NEW YORK, 14850
Covered Property
(1)
Metal Etchant Compositions and Methods of Fabricating a Semiconductor Device Using the Same
Application:
14/312,043 →
Publication:
US 2015/0368557