Patent Assignment
Reel/Frame 034006/0756
Assignment of Assignor's Interest
Recorded: 2014-10-22
Pages: 6
Assignors
OH, JUNG-IK
Executed: 2014-09-04
JANG, DAEHYUN
Executed: 2014-09-04
KIM, HA-NA
Executed: 2014-09-04
SHIN, KYOUNGSUB
Executed: 2014-09-05
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Staircase-Shaped Connection Structures of Three-Dimensional Semiconductor Devices