IP Library Assignment 034011/0697
Patent Assignment
Reel/Frame 034011/0697

Assignment of Assignor's Interest

Recorded: 2014-10-22 Pages: 3
Assignors
CHEN, HSIN-YU
Executed: 2012-06-18
CHENG, HOME-BEEN
Executed: 2012-06-18
TSAI, YU-HAN
Executed: 2012-06-18
YANG, CHING-LI
Executed: 2012-06-18
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property (1)
Through silicon via structure
Patent: 9,312,208 →
Application: 14/521,456 →
Publication: US 2015/0041961
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 26, 2021
From: UNITED MICROELECTRONICS CORPORATION
To: MARLIN SEMICONDUCTOR LIMITED
Reel/Frame 056991/0292 →