Through silicon via structure
View Patent ↗A through silicon via structure is disclosed. The through silicon via includes: a substrate; a first dielectric layer disposed on the substrate and having a plurality of first openings, in which a bottom of the plurality of first openings is located lower than an original surface of the substrate; a via hole disposed through the first dielectric layer and the substrate, in which the via hole not overlapping for all of the plurality of first openings; a second dielectric layer disposed within the plurality of first openings and on a sidewall of the via hole while filling the plurality of first openings; and a conductive material layer disposed within the via hole having the second dielectric layer on the sidewall of the via hole, thereby forming a through silicon via.
1. A through silicon via structure, comprising:
a substrate;
a first dielectric layer disposed on the substrate and having a plurality of first openings, wherein a bottom of the plurality of first openings is located lower than an original surface of the substrate;
a via hole disposed through the first dielectric layer and the substrate, wherein the via hole not overlapping for all of the plurality of first openings;
a second dielectric layer disposed within the plurality of first openings and on a sidewall of the via hole while filling the plurality of first openings completely; and
a conductive material layer disposed within the via hole having the second dielectric layer on the sidewall of the via hole, thereby forming a through silicon via, wherein the second dielectric layer comprises a plurality of second openings corresponding to the plurality of first openings, and the conductive material layer is further disposed within the plurality of second openings to form a plurality of dummy through silicon vias.
2. The through silicon via structure according to claim 1 , further comprising a barrier layer between the conductive material layer and the second dielectric layer.
3. The through silicon via structure according to claim 1 , wherein a diameter of the through silicon via and a diameter of one of the plurality of dummy through silicon vias are the same.
4. The through silicon via structure according to claim 1 , wherein the substrate comprises a semiconductor element.