Patent Assignment
Reel/Frame 034019/0773
Assignment of Assignor's Interest
Recorded: 2014-10-23
Pages: 4
Assignors
LIN, CHU-FU
Executed: 2014-06-18
KUO, CHIEN-LI
Executed: 2014-07-04
CHEN, KUO-MING
Executed: 2014-06-15
Assignee
UNITED MICROELECTRONICS CORP.
NO3, LI-HSIN RD.II, HSINCHU SCIENCE PARK, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Fan-Out Wafer Level Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.