IP Library › Assignment 034027/0286
Patent Assignment
Reel/Frame 034027/0286

Assignment of Assignor's Interest

Recorded: 2014-10-24 Pages: 7
Assignors
PARK, JONGCHUL
Executed: 2014-09-05
BAE, BYOUNGJAE
Executed: 2014-09-05
KIM, INHO
Executed: 2014-09-05
KWON, SHIN
Executed: 2014-09-05
NOH, EUNSUN
Executed: 2014-09-06
PARK, INSUN
Executed: 2014-09-06
LEE, SANGMIN
Executed: 2014-09-06
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property (1)
Methods of Manufacturing Semiconductor Devices Using Cavities to Distribute Conductive Patterning Residue
Patent: 9,515,255 →
Application: 14/522,865 →
Publication: US 2015/0194599
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 6, 2015
From: PARK, JONGCHUL; BAE, BYOUNGJAE; KIM, INHO; KWON, SHIN
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 035572/0861 →