IP Library › Assignment 035572/0861
Patent Assignment
Reel/Frame 035572/0861

Assignment of Assignor's Interest

Recorded: 2015-05-06 Pages: 12
Assignors
PARK, JONGCHUL
Executed: 2015-03-23
BAE, BYOUNGJAE
Executed: 2015-03-23
KIM, INHO
Executed: 2015-03-23
KWON, SHIN
Executed: 2015-03-23
NOH, EUNSUN
Executed: 2015-03-23
PARK, INSUN
Executed: 2015-03-21
LEE, SANGMIN
Executed: 2015-03-27
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property (1)
Methods of Manufacturing Semiconductor Devices Using Cavities to Distribute Conductive Patterning Residue
Patent: 9,515,255 →
Application: 14/522,865 →
Publication: US 2015/0194599
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 24, 2014
From: PARK, JONGCHUL; BAE, BYOUNGJAE; KIM, INHO; KWON, SHIN
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 034027/0286 →