Patent Assignment
Reel/Frame 034142/0907
Assignment of Assignor's Interest
Recorded: 2014-11-11
Pages: 4
Assignors
AIDA, HIDEO
Executed: 2014-09-26
AOTA, NATSUKO
Executed: 2014-09-30
TAKEDA, HIDETOSHI
Executed: 2014-09-26
HONJO, KEIJI
Executed: 2014-10-01
HOSHINO, HITOSHI
Executed: 2014-10-03
OGASAWARA, MAI
Executed: 2014-10-07
Assignees
NAMIKI SEIMITSU HOUSEKI KABUSHIKIKAISHA
8-22, SHINDEN 3-CHOME, ADACHI-KU, TOKYO, 1238511, JAPAN
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU, TOKYO, 143-8580, JAPAN
Covered Property
(1)
Composite Substrate Manufacturing Method, Semiconductor Element Manufacturing Method, Composite Substrate, and Semiconductor Element
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.