Patent Assignment
Reel/Frame 034154/0797
Assignment of Assignor's Interest
Recorded: 2014-11-12
Pages: 2
Assignor
LIN, TZU-HUNG
Executed: 2014-11-03
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300, TAIWAN
Covered Property
(1)
Structure and Formation Method of Chip Package Structure