Patent Assignment
Reel/Frame 034174/0234
Assignment of Assignor's Interest
Recorded: 2014-11-14
Pages: 2
Assignee
NORTH CORPORATION
32-1, MINAMI-OTSUKA 3-CHOME, TOSHIMA-KU, TOKYO, 170-0005, JAPAN
Covered Property
(1)
Multilayer Wiring Board for an Electronic Device
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 23, 2016
From: NORTH CORPORATION
To: SOCKETSTRATE, INC.
Reel/Frame 038683/0500 →
Change of Name
May 24, 2016
From: SOCKETSTRATE, INC.
To: TESSERA INTERCONNECT MATERIALS, INC.
Reel/Frame 038800/0429 →
Merger
May 25, 2016
From: TESSERA INTERCONNECT MATERIALS, INC.
To: INVENSAS CORPORATION
Reel/Frame 038715/0460 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →