IP Library Assignment 038800/0429
Patent Assignment
Reel/Frame 038800/0429

Change of Name

Recorded: 2016-05-24 Pages: 3
Assignor
SOCKETSTRATE, INC.
Executed: 2006-03-01
Assignee
TESSERA INTERCONNECT MATERIALS, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Multilayer Wiring Board for an Electronic Device
Patent: 9,521,755 →
Application: 14/271,959 →
Publication: US 2014/0240934
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 14, 2014
From: IIJIMA, TOMOO; FUKUOKA, YOSHITAKA
To: NORTH CORPORATION
Reel/Frame 034174/0234 →
Assignment of Assignor's Interest May 23, 2016
From: NORTH CORPORATION
To: SOCKETSTRATE, INC.
Reel/Frame 038683/0500 →
Merger May 25, 2016
From: TESSERA INTERCONNECT MATERIALS, INC.
To: INVENSAS CORPORATION
Reel/Frame 038715/0460 →
Security Interest Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →