Patent Assignment
Reel/Frame 038715/0460
Merger
Recorded: 2016-05-25
Pages: 4
Assignor
TESSERA INTERCONNECT MATERIALS, INC.
Executed: 2011-12-23
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Multilayer Wiring Board for an Electronic Device
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 14, 2014
From: IIJIMA, TOMOO; FUKUOKA, YOSHITAKA
To: NORTH CORPORATION
Reel/Frame 034174/0234 →
Assignment of Assignor's Interest
May 23, 2016
From: NORTH CORPORATION
To: SOCKETSTRATE, INC.
Reel/Frame 038683/0500 →
Change of Name
May 24, 2016
From: SOCKETSTRATE, INC.
To: TESSERA INTERCONNECT MATERIALS, INC.
Reel/Frame 038800/0429 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →