Patent Assignment
Reel/Frame 034191/0384
Assignment of Assignor's Interest
Recorded: 2014-11-17
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2014-09-16
CHEN, MING-FA
Executed: 2014-09-16
YEH, SUNG-FENG
Executed: 2014-09-16
CHEN, MENG-TSE
Executed: 2014-09-16
HUANG, HUI-MIN
Executed: 2014-09-17
LIN, HSIU-JEN
Executed: 2014-09-17
CHENG, MING-DA
Executed: 2014-09-17
LIU, CHUNG-SHI
Executed: 2014-09-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Stacked Dies With Wire Bonds and Method