Patent Assignment
Reel/Frame 034204/0042
Assignment of Assignor's Interest
Recorded: 2014-11-11
Pages: 7
Assignors
LEE, JAE UNG
Executed: 2014-11-10
KIM, BYONG JIN
Executed: 2014-11-11
NAMKUNG, YOON KI
Executed: 2014-11-11
OH, SE MAN
Executed: 2014-11-10
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85286-6604
Covered Property
(1)
Semiconductor Package Structure and Manufacturing Method Thereof
Application:
14/538,018 →
Publication:
US 2015/0130054
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →