Patent Assignment
Reel/Frame 034282/0390
Assignment of Assignor's Interest
Recorded: 2014-11-30
Pages: 7
Assignors
CHEN, CHUN-HUNG
Executed: 2014-11-27
KUO, CHIEN-LI
Executed: 2014-11-27
LIN, MING-TSE
Executed: 2014-11-27
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Through-Substrate Structure and Method for Fabricating the Same