Through-substrate structure and method for fabricating the same
A method for fabricating through-substrate structure is disclosed. The method includes the steps of: providing a substrate; forming a through-substrate hole and a through-substrate trench in the substrate; and forming a metal layer in the through-substrate hole and the through-substrate trench for forming a through-substrate via and a through-substrate conductor having a void therein.
1. A through-substrate structure, comprising:
a through-substrate conductor extending but not completely through a substrate, wherein the through-substrate conductor comprises a void and the void is substantially vacant and a bottom surface of the through-substrate conductor contacts the substrate directly; and
a through-substrate via completely extending through the substrate.
2. The through-substrate structure of claim 1 , further comprising:
a through-substrate via in the substrate, wherein the through-substrate via is surrounded by the through-substrate conductor under 3-dimensional view of the through-substrate via and the through-substrate conductor, respectively.
3. The through-substrate structure of claim 2 , wherein each of the through-substrate conductor and the through-substrate via comprises sidewall scallops.
4. The through-substrate structure of claim 2 , wherein the through-substrate conductor surrounds the through-substrate via according to a circular shape or rectangular shape.
5. The through-substrate structure of claim 2 , wherein the through-substrate via comprises a seed layer enclosing no void therein.
6. The through-substrate structure of claim 5 , wherein the seed layer comprises copper.
7. A through-substrate structure, comprising:
a through-substrate conductor in a substrate, wherein the through-substrate conductor comprises a seed layer enclosing a void therein and in direct contact with the void and a metal layer on the seed layer, wherein the void is enclosed by the seed layer completely, the seed layer being of a conformal structure made of copper, the metal layer filling a through-substrate hole, a through-substrate trench, but without filling the void.
8. The through-substrate structure of claim 7 , further comprising:
a through-substrate via in the substrate, wherein the through-substrate via is surrounded by the through-substrate conductor.
9. The through-substrate structure of claim 8 , wherein each of the through-substrate conductor and the through-substrate via comprises sidewall scallops.
10. The through-substrate structure of claim 8 , wherein the through-substrate conductor surrounds the through-substrate via according to a circular shape or rectangular shape.
11. The through-substrate structure of claim 8 , wherein the through-substrate via comprises the seed layer enclosing no void therein.
12. The through-substrate structure of claim 11 , wherein the seed layer comprises copper.