IP Library Assignment 034390/0786
Patent Assignment
Reel/Frame 034390/0786

Assignment of Assignor's Interest

Recorded: 2014-12-05 Pages: 10
Assignors
YAN, JUNRONG
Executed: 2014-06-12
WANG, WEILI
Executed: 2014-06-11
WANG, LI
Executed: 2014-06-17
RAI, PRADEEP
Executed: 2014-06-11
LU, XIN
Executed: 2014-06-17
GU, JIANBIN
Executed: 2014-06-17
LU, PENG
Executed: 2014-06-11
Assignee
SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD.
NO. 388, JIANG CHUAN EAST ROAD, MINHANG DISTRICT, SHANGHAI, 200241, CHINA
Covered Property (1)
Spacer Layer for Embedding Semiconductor Die
Patent: 9,462,694 →
Application: 14/561,768 →
Publication: US 2015/0187421
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 10, 2024
From: SANDISK SEMICONDUCTOR (SHANGHAI) CO. LTD.
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 066087/0461 →