IP Library › Assignment 066087/0461
Patent Assignment
Reel/Frame 066087/0461

Assignment of Assignor's Interest

Recorded: 2024-01-10 Pages: 6
Assignor
Assignee
SANDISK TECHNOLOGIES LLC
5601 GREAT OAKS PKWY., LEGAL DEP., SAN JOSE, CALIFORNIA, 95119
Covered Properties (6)
Spacer Layer for Embedding Semiconductor Die
Patent: 9,462,694 →
Application: 14/561,768 →
Publication: US 2015/0187421
Discrete Component Backward Traceability and Semiconductor Device Forward Traceability
Application: 15/053,575 →
Publication: US 2016/0181205
Semiconductor Device Including Conductive Bump Interconnections
Application: 15/617,867 →
Publication: US 2018/0337161
Semiconductor Device Including Corner Recess
Application: 15/630,666 →
Publication: US 2018/0174983
Semiconductor Device Including Die Bond Pads at a Die Edge
Application: 15/630,712 →
Publication: US 2018/0175006
Semiconductor Device Including Dual Pad Wire Bond Interconnection
Application: 15/907,600 →
Publication: US 2018/0190621
Related Assignments (9)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 5, 2014
From: YAN, JUNRONG; WANG, WEILI; WANG, LI; RAI, PRADEEP
To: SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD.
Reel/Frame 034390/0786 →
Assignment of Assignor's Interest Feb 25, 2016
From: YU, CHEEMAN; CHAVET, DIDIER
To: SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD.
Reel/Frame 037830/0913 →
Assignment of Assignor's Interest Jun 8, 2017
From: YAN, JUNRONG; DI, XIAOFENG; CHIN, CHEE KEONG; BOCK, KIM LEE
To: SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD.
Reel/Frame 042654/0720 →
Assignment of Assignor's Interest Jun 22, 2017
From: ZHANG, HANG; WANG, WEILI; YAN, JUNRONG; BOCK, KIM LEE
To: SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD.
Reel/Frame 042790/0944 →
Assignment of Assignor's Interest Jun 22, 2017
From: YAN, JUNRONG; CHIN, CHEE KEONG; TAN, CHONG UN; WU, MING XIA
To: SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD.
Reel/Frame 042791/0254 →
Assignment of Assignor's Interest Feb 28, 2018
From: YAN, JUNRONG; DI, XIAOFENG; SINGH, HARJASHAN; KUMAR, GOKUL
To: SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD.
Reel/Frame 045062/0391 →
Assignment of Assignor's Interest Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Partial Release of Security Interests Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
Security Agreement Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →