Patent Assignment
Reel/Frame 045062/0391
Assignment of Assignor's Interest
Recorded: 2018-02-28
Pages: 10
Assignors
YAN, JUNRONG
Executed: 2018-02-26
DI, XIAOFENG
Executed: 2018-02-26
SINGH, HARJASHAN
Executed: 2018-02-27
KUMAR, GOKUL
Executed: 2018-02-21
CHIN, CHEE KEONG
Executed: 2018-02-26
WU, MING XIA
Executed: 2018-02-26
GU, JIAN BIN
Executed: 2018-02-26
Assignee
SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD.
NO. 388, JIANG CHUAN EAST ROAD, MINHANG DISTRICT, SHANGHAI, 200241, CHINA
Covered Property
(1)
Semiconductor Device Including Dual Pad Wire Bond Interconnection
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 10, 2024
From: SANDISK SEMICONDUCTOR (SHANGHAI) CO. LTD.
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 066087/0461 →
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →