Patent Assignment
Reel/Frame 042791/0254
Assignment of Assignor's Interest
Recorded: 2017-06-22
Pages: 9
Assignors
YAN, JUNRONG
Executed: 2017-06-20
CHIN, CHEE KEONG
Executed: 2017-06-20
TAN, CHONG UN
Executed: 2017-06-20
WU, MING XIA
Executed: 2017-06-20
BOCK, KIM LEE
Executed: 2017-06-12
BHAGATH, SHRIKAR
Executed: 2017-06-20
Assignee
SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD.
NO. 388, JIANG CHUAN EAST ROAD, MINHANG DISTRICT, SHANGHAI, 200241, CHINA
Covered Property
(1)
Semiconductor Device Including Die Bond Pads at a Die Edge
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 10, 2024
From: SANDISK SEMICONDUCTOR (SHANGHAI) CO. LTD.
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 066087/0461 →
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →