Patent Assignment
Reel/Frame 034417/0877
Assignment of Assignor's Interest
Recorded: 2014-12-08
Pages: 13
Assignors
LEE, DONGHOON
Executed: 2014-11-03
KIM, DOHYUNG
Executed: 2014-11-03
PARK, JUNGSOO
Executed: 2014-11-03
HAN, SEUNGCHUL
Executed: 2014-11-04
KIM, JOOHYUN
Executed: 2014-11-04
HINER, DAVID JON
Executed: 2014-11-05
HUEMOELLER, RONALD PATRICK
Executed: 2014-10-31
KELLY, MICHAEL G.
Executed: 2014-11-04
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85286-6604
Covered Property
(1)
Interposer, Manufacturing Method Thereof, Semiconductor Package Using the Same, and Method for Fabricating the Semiconductor Package
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →