Patent Assignment
Reel/Frame 034495/0462
Assignment of Assignor's Interest
Recorded: 2014-12-12
Pages: 2
Assignor
MATSUMOTO, YOSHIIE
Executed: 2014-11-25
Assignee
LAN TECHNICAL SERVICE CO., LTD.
26-2-32F, NISHI-SHINJUKU 1-CHOME, SHINJUKU-KU, TOKYO, 163-0532, JAPAN
Covered Property
(1)
Electronic Element Sealing Method and Bonded Substrate
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.